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  1. Inicio /
  2. Embedded Computing /
  3. Computer On Modules /
  4. COM-HPC /
  5. Extension /

Extension

SOM-DH7000

Development Board for COM-HPC® Extension Modules

  • COM-HPC® Extension Size E
  • RunBMCv1.5 260pin socket interface (A2)
  • 1 PCIe x1 reserved for BMC add-in card (A1)
  • Rich extension: 4 x PCIe x16, 1 PCIe x8, 1 PCIe x4, 2 PCIex1 (Gen 5)
  • Max. power 225W supplying for server grade processor
  • Visible Debug Utility: BIOS 80 Port and Power State

Enlaces de soporte:

Ficha técnica Descargas Técnicas
  • Development Board for COM-HPC® Extension Modules

Especificaciones

Expansion
PCI Express x 16
  • 4
  • 4
PCI Express x 1
  • 1
  • 1
PCI Express x 8
  • 1
  • 1
PCI Express x 4
  • 1
  • 1
LPC
  • 1
  • 1
Serial Bus
SMBus
  • Yes
  • Yes
I2 C Bus
  • Yes
  • Yes
I/O
SATA 3.0
  • 2 Ports
  • 2 Ports
USB 3.2 Gen1 (USB3.2)
  • 4 Ports (Gen2)
  • 4 Ports (Gen2)
USB2.0
  • 4
  • 4
COM Port
  • 1
  • 1
GPIO
  • 12
  • 12
FAN
  • 2
  • 2
Port 80
  • 1
  • 1
Power
Power Type
  • ATX: Vin, VSB; AT: Vin
  • ATX: Vin, VSB; AT: Vin
Power Supply Voltage
  • Single 5V,±5% (+12V option for LCD)
  • Single 5V,±5% (+12V option for LCD)
Environment
Operating Temperature
  • 0 ~ 60° C (32 ~ 140° F)
  • 0 ~ 60° C (32 ~ 140° F)
Storage Temperature
  • - 40 ~ 85° C (-40 ~185° F)
  • - 40 ~ 85° C (-40 ~185° F)
Humidity
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
Mechanical
Dimensions
  • 100 x 72 mm
  • 100 x 72 mm

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