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SOM-6882

Intel® 8th Gen Core Processors COM Express Compact Module R3.0 Type6

  • On board storage eMMC up to 64GB, TPM2.0 (Optional)
  • High speed I/O: 4 USB3.1 (Gen2), 6 PCIe X1 (Gen3), 4 SATA (Gen3)
  • Intel® 8th Gen Core Processors Product Family with Dual channel DDR4 Max 32GB memory
  • Supports SUSI, DeviceOn and Edge AI Suite

Enlaces de soporte:

Ficha técnica Descargas Técnicas

Especificaciones

Form Factor
Form Factor
  • COM Express Compact R2.1, Type 6 Pin-out
Pin-out Type
  • Type 6
Processor
CPU
  • Celeron 4305UE
Frequency
  • 2.0 GHz
Max Turbo Frequency
  • -
Core Number
  • 2
LLC
  • 2MB
CPU TDP
  • 15W
BIOS
  • AMI UEFI 256 Mbit
Memory
ECC Support
  • N/A
Technology
  • DDR4 2133MHz SO-DIMM
Max. Capacity
  • 64GB (up to 32GB per SO-DIMM)
Socket
  • 2 x 260-pin SO-DIMM
Graphics
Controller
  • Intel® UHD Graphics 610
Max. Frequency
  • 1 GHz
Display
VGA
  • 1920 x 1200 at 60Hz
LCD
  • LVDS: Dual channel 18/24-bit, up to 1920 x 1080
Triple Display
  • Yes
Expansion
PCI Express x 1
  • 4 PCIex1
PCI Express x 4
  • 1
LPC
  • Yes (24MHz)
I2C Bus
  • Yes
Serial Bus
SMBus
  • Yes
Ethernet
Controller
  • Intel i219LM
Speed
  • 10/100/1000Mbps
I/O
SATA
  • 3 x SATAII
USB3.0
  • 4
USB2.0
  • 8
SPI Bus
  • Yes
GPIO
  • 8-bit GPIO
Watchdog timer
  • 65536 level, 0 ~ 65535 sec
COM Port
  • 2 (2-wire)
TPM
  • TPM 2.0
Smart Fan
  • 2 Ports: 1 port on COM module (Notice: the input voltage of fan is aligned to Vin); 1 port on carrier board
Power
Power Type
  • ATX: Vin, VSB; AT: Vin
Supply Voltage
  • Vin: 8.5V ~ 20V; VSB: 4.75V ~ 5.25 V, RTC Battery: 2.0V ~ 3.3V
Environment
Operating Temperature
  • 0 ~ 60° C (32 ~ 140° F), Extend: -40 ~ 85° C (-40 ~ 185° F)
Storage Temperature
  • -40 ~ 85° C (-40 ~ 185° F)
Humidity
  • Operating: 40° C @ 95% relative humidity, non-condensing; Storage: 60° C @ 95%relative humidity, non-condensing
Vibration Resistance
  • 3.5 Grms
Mechanical
Dimensions
  • 95 x 95 mm (3.74" x 3.74")