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TPC-B520

搭載 Intel® Core™ 處理器(第 13 代)的運算模組

  • Modular Computing Box powered by Intel® Core™ processors (13th gen) i5-1335UE deca-core/ i7-1365URE deca-core processor
  • Single DDR5 Memory slot supports up to 32GB
  • Support expansion via three M.2 slots (NVMe, Wifi, 5G)
  • LAN, POE, isolated serial port and isolated digital I/O via iDoor technology
  • Support Type C connector with USB 3.2, DP 1.4a, 15W power delivery
  • Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology
  • Modular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)

認證:

規格

Environment
Operating Temperature
  • -10~60 °C (14~140 °F)
  • -20~60 °C (-4~140 °F)
Storage Temperature
  • -30~70 °C (-22~158 °F)
  • -30~70 °C (-22~158 °F)
Vibration Protection
  • 1 Grms, random
  • 1 Grms, random
Shock Protection
  • 10 G, half sine
  • 10 G, half sine
Hardware
Certification
  • CB/UL, CE, FCC Class A, CCC, BIS, BSMI, RoHS
  • CB/UL, CE, FCC Class A, CCC, BIS, BSMI, RoHS
CPU
  • Intel® Core™ i5-1335UE 1.3GHz 10-Core
  • Intel® Core™ i7-1365UE 1.7GHz 10-Core
Hardware Security
  • TPM 2.0
  • TPM 2.0
I/O
  • 2 x RS-232/422/485, 2 x USB 3.1, 2 x USB 2.0, 1 x Type C, 1 x DP, 1 x iDoor Slot
  • 2 x RS-232/422/485, 2 x USB 3.1, 2 x USB 2.0, 1 x Type C, 1 x DP, 1 x iDoor Slot
LAN
  • 2 x 2500 Mbps
  • 2 x 2500 Mbps
Storage
  • 1 x M.2 B key, 1 x 2.5" SSD/HDD Bay
  • 1 x M.2 B key, 1 x 2.5" SSD/HDD Bay
Expansion
  • 1 x M.2 E Key 2230
  • 1 x M.2 E Key 2230
I/O Interface
Expansion
  • 1 x M.2 B key, 1 x M.2 E key
  • 1 x M.2 B key, 1 x M.2 E key
Displays
  • 1 x DP
  • 1 x DP
Power Connector
  • 1 x 3-Pin Terminal Block
  • 1 x 3-Pin Terminal Block
Expansion Function
SIM card slot
  • Nano SIM card
  • Nano SIM card
Mechanical
Mounting
  • Panel, Wall, Stand, VESA
  • Panel, Wall, Stand, VESA
Weight (Net)
  • 2.8 kg (6.17 lb)
  • 2.8 kg (6.17 lb)